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mil-m-38510/314c 14 july 2003 __ superseding mil-m-38510/314b 23 may 1978 military specification microcircuits, digital, low-power schottky, ttl, monostable multivibrators, monolithic silicon this specification is approved for use by all departments and agencies of the department of defense. 1. scope 1.1 scope. this specification covers the detail requirements for monolithic silicon, low-power schottky ttl, monostable multivibrator microcircuits. two product as surance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in t he complete part number. for this product, the requirements of mil-m-38510 have been superseded by mil-prf-38535, (see 6.3). 1.2 part number. the part number should be in accordance with mil-prf-38535, and as specified herein. 1.2.1 device types. the device types should be as follows: device type circuit 01 dual monostable multivibrator, retriggerable, with clear 02 dual monostable multivibrator, schmitt trigger inputs, with clear 03 single monostable multivibrator, retriggerable, with clear 1.2.2 device class. the device class should be the product assurance level as defined in mil-prf-38535. 1.2.3 case outlines. the case outlines should be as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style a gdfp5-f14 or cdfp6-f14 14 flat pack b gdfp4-14 14 flat pack c gdip1-t14 or cdip2-t14 14 dual-in-line d gdfp1-f14 or cdfp2-f14 14 flat pack e gdip1-t16 or cdip2-t16 16 dual-in-line f gdfp2-f16 or cdfp3-f16 16 flat pack 2 cqcc1-n20 20 square leadless chip carrier beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: commander, defense supply center columbus, attn: dscc-vas, p. o. box 3990, columbus, oh 43216-5000, by using the self addressed standardization document improvement proposal (dd form 1426) appearing at the end of this document or by letter. amsc n/a fsc 5962 distribution statement a. approved for public release; distribution is unlimited. inch - pound inactive for new design after 18 april 1997.
mil-m-38510/314c 2 1.3 absolute maximum ratings. supply voltage range ............................................................................. -0.5 v dc to 7.0 v dc input voltage range ................................................................................ -1.5 v dc at -18 ma to 5.5 v dc storage temperatur e range .................................................................... -65 to +150 c maximum power dissipation per flip-flop, (p d ) 1 / device type 01 ................................................................................. 110 mw dc device type 02 .................................................................................. 149 mw dc device type 03 .................................................................................. 61 mw dc lead temperature (solderi ng, 10 seco nds) ............................................. 300 c thermal resistance, junction to case ( jc ): cases a, b, c, d, e, f, and 2 ............................................................... (see mil-std-1835) junction temperature (t j ) 2 /.................................................................... 175 c 1.4 recommended operating conditions. supply voltage (v cc ) .............................................................................. 4.5 v dc minimum to 5.5 v dc maximum minimum high level input voltage (v ih ) ................................................... 2.0 v dc maximum low level input voltage (v il ) .................................................... 0.7 v dc case operating temperature range (t c ) ................................................. -55 to +125 c minimum pulse wi dth .............................................................................. 40 ns input pulse rise/fall time, device type 02 schmitt, b input ................................................................................ 1 v/s minimum logic, a input ................................................................................... 1 v/ s minimum clear-inactive-state setup time device type 02 ................................................................................. 15 ns minimum external timing resistance, rext device type 01, 03 ........................................................................... 5 k ? minimum, 180 k ? maximum device type 02 ................................................................................. 1.4 k ? minimum, 70 k ? maximum external timing capacitance, cext device type 01, 03 ........................................................................... no restriction device type 02 ................................................................................. 1,000 f maximum output duty cycle, device type 02 r t = 2 k ? ......................................................................................... 50% duty cycle maximum t t = 70 k ? ........................................................................................ 90 % duty cycle maximum wiring capacitance, rext/cext terminal device type 01, 03 (referenced to gnd) .......................................... 50 pf maximum _______ 1 / must withstand the added p d due to short-circuit test (e.g., i os ). 2 / maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with mil-prf-38535.
mil-m-38510/314c 3 2. applicable documents 2.1 government documents . 2.1.1 specifications and standards. the following specifications and standards form a part of this specification to the extent specified herein. unless otherwise specified, the issues of these documents shall be those listed in the issue of the departments of defense index of specifications and standards (dodiss) and supplement thereto, cited in the solicitation. specification department of defense mil-prf-38535 - integrated circuits (microcircui ts) manufacturing, general specification for. standards department of defense mil-std-883 - test method standard for microelectronics. mil-std-1835 - interface standard electronic component case outlines (unless otherwise indicated, copies of the above specifications and standards are available from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence. in the event of a conflict between the text of this specification and the references cited herein, the text of this document takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 qualification. microcircuits furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and 6.4). 3.2 item requirements . the individual item requirements shall be in accordance with mil-prf-38535 and as specified herein or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. 3.3 design, construction, and physical dimensions. the design, construction, and physical dimensions shall be as specified in mil-prf-38535 and herein. 3.3.1 terminal connections and logic diagrams. the terminal connections and logic diagrams shall be as specified on figure 1. 3.3.2 truth table and functional description. the truth table and functional description shall be as specified on figure 2. 3.3.3 schematic circuits. the schematic circuits shall be maintained by the manufacturer and made available to the qualifying activity and the preparing activity upon request. 3.3.4 case outlines. the case outlines shall be as specified in 1.2.3. 3.4 lead material and finish. the lead material and finish shall be in accordance with mil-prf-38535 (see 6.6).
mil-m-38510/314c 4 3.5 electrical performance characteristics . the electrical performance characteristics are as specified in table i, and apply over the full recommended case operating temper ature range, unless otherwise specified. 3.6 electrical test requirements. the electrical test requirements for each device class shall be the subgroups specified in table ii. the electrical tests for each subgroup are described in table iii. 3.7 marking. marking shall be in accordance with mil-prf-38535. 3.8 microcircuit group assignment. the devices covered by this specification shall be in microcircuit group number 10 (see mil-prf-38535, appendix a). 4. verification 4.1 sampling and inspection. sampling and inspection procedures shall be in accordance with mil-prf-38535 or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not effect the form, fit, or function as described herein. 4.2 screening. screening shall be in accordance with, mil-prf-38535 and shall be conducted on all devices prior to qualification and quality conformance inspection. the following additional criteria shall apply: a. the burn-in test duration, test condition, and test temper ature, or approved alternatives shall be as specified in the device manufacturer's qm plan in accordance with mil-prf-38535. the burn-in test circuit shall be maintained under document control by the device manufacturer's technology review board (trb) in accordance with mil- prf-38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of mil-std-883. b. interim and final electrical test parameters shall be as spec ified in table ii, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer. c. additional screening for space level product shall be as specified in mil-prf-38535, appendix b. 4.3 qualification inspection. qualification inspection shall be in accordance with mil-prf-38535. 4.4 technology conformance inspection (tci). technology conformance inspection shall be in accordance with mil-prf-38535 and herein for groups a, b, c, an d d inspections (see 4.4.1 through 4.4.4). 4.4.1 group a inspection. group a inspection shall be in accordance with table iii of mil-prf-38535 and as follows: a. tests shall be as specified in table ii herein. b. subgroups 4, 5, and 6 shall be omitted.
mil-m-38510/314c 5 table i. electrical performance characteristics. test symbol conditions device limits unit -55 c t c +125 c unless otherwise specified types min max high level output voltage v oh v cc = 4.5 v, v il = 0.7 v, all 2.5 v v ih = 2.0 v, i oh = -400 a low level output voltage v ol v cc = 4.5 v, v il = 0.7 v, all 0.4 v v ih = 2.0 v, i ol = 4 ma input clamp voltage v ic v cc = 4.5 v, i in = -18 ma, all -1.5 v t c = +25 c low level input current i il1 v cc = 5.5 v, v in = 0.4 v 01, 03 -160 -400 a low level input current i il2 02 -30 -680 at clear input low level input current at a in 02 -30 -400 low level input current b in 02 -30 -580 high level input current i ih1 v cc = 5.5 v, v in = 2.7 v all 20 a high level input current i ih2 v cc = 5.5 v, v in = 5.5 v all 100 short circuit output current i os v cc = 5.5 v, v ih = 5.5 v, all -15 -130 ma v il = gnd supply current (quiescent) i cc1 v cc = 5.5 v 02 11 ma supply current (quiescent or i cc2 01 20 triggered) 03 11 supply current (triggered) i cc3 02 27 propagation delay time low to t plh1 v cc = 5.0 v 01, 03 5 57 ns high level from input a c l = 50 pf 5%, r l = 2 k ? 5% 02 5 113 propagation delay time low to t plh2 cext = 1 / 01, 03 5 74 high level from input b rext = 1 / 02 5 90 propagation delay time low to t plh3 01, 03 5 75 high level from clear 02 5 105 propagation delay time t phl1 01, 03 5 75 high to low level from input a 02 5 128 see footnotes at end of table.
mil-m-38510/314c 6 table i. electrical performance characteristics - continued. test symbol conditions device limits unit -55 c t c +125 c unless otherwise specified types min max propagation delay time t phl2 v cc = 5.0 v 01, 03 5 92 ns high to low level from input b c l = 50 pf 10% 02 5 105 r l = 2k ? 5% propagation delay time t phl3 cext = 1 / 01, 03 5 48 ns high to low level from clear rext = 1 / 02 5 90 minimum pulse width t p(min) v cc = 5.0 v 01, 03 308 ns of q output c l = 50 pf 10% width of q output pulse t p1 r l = 2k ? 5% 02 20 91 t p2 cext = 2 / 10% 02 70 195 t p3 rext = 2 / 10% 02 600 850 t p4 01, 03 3.0 6.25 s t p5 02 5.5 8.5 ms 1 / for propagation delay tests, see table iii for cext and rext values. 2 / t p(min) test, cext = open and rext = 5 k ? . t p1 test, cext = open and rext = 2 k ? . t p2 test, cext = 80 pf and rext = 2 k ? . t p3 test, cext = 100 pf and rext = 10 k ? . t p4 test, cext = 1,000 pf and rext = 10 k ? . t p5 test, cext = 1 f and rext = 10 k ? .
mil-m-38510/314c 7 table ii. electrical test requirements. subgroups (see table iii) mil-prf-38535 test requirements class s devices class b devices interim electrical parameters 1 1 final electrical test parameters 1*, 2, 3, 7, 9, 10, 11 1*, 2, 3, 7, 9 group a test requirements 1, 2, 3, 7, 8, 9, 10, 11 1, 2, 3, 7, 8, 9 group b electrical test parameters when using method 5005 qci option 1, 2, 3 9, 10, 11 n/a group c end-point electrical parameters 1, 2, 3, 9, 10, 11 1, 2, 3 additional electrical subgroups for group c inspections n/a 10, 11 group d end-point electrical parameters 1, 2, 3 1, 2, 3 *pda applies to subgroup 1. 4.4.2 group b inspection. group b inspection shall be in accordance with table ii mil-prf-38535. 4.4.3 group c inspection. group c inspection shall be in accordance with table iv of mil-prf-38535 and as follows: a. end-point electrical parameters shal l be as specified in table ii herein. b. the steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's qm plan in accordance with mil-prf-38535. the burn-in test circuit shall be maintained under document control by the device manufacturer's technology review board (trb) in accordance with mil-prf-38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of mil-std-883. c. subgroups 3 and 4 shall be added to group c inspection parameters for class b devices and shall consist of the tests, conditions, and limits specified for subgroups 10 and 11 of group a. 4.4.4 group d inspection. group d inspection shall be in accordance with table v of mil-prf-38535. end-point electrical parameters shall be as specified in table ii herein. 4.5 methods of inspection. methods of inspection shall be specified and as follows: 4.5.1 voltage and current. all voltages given are referenced to the microcircuit ground terminal. currents given are conventional and positive when flowing into the referenced terminal.
mil-m-38510/314c 8 figure 1. terminal connections .
mil-m-38510/314c 9 figure 1. terminal connections - continued.
mil-m-38510/314c 10 figure 1. terminal connections - continued.
mil-m-38510/314c 11 device type 01 and 02 inputs outputs clear a b q q l x x l h x h x l h x x l l h h l h h l h device type 03 inputs outputs clear a1 a2 b1 b2 q q l x x x x l h x h h x x l h x x x l x l h x x x x l l h h l x h h l x h h x l h h x l h h h h h h h h h h h h l x h h x l h h notes: 1. h = high level (steady state), l = low level (steady state), = transition from low to high level, = transition from high to low level, = one high level pulse, = one low level pulse, x = irrelevant (any input, including transitions). 2. to use the internal timing resistor of device type 03 connect rint to v cc . 3. an external timing capacitor may be connected between cext and rext/cext (positive). 4. for accurate repeatable pulse widths, connect an external resistor between rext/cext and v cc with rint open circuited. 5. to obtain variable pulse widths, connect external variable resistance between rint or rext/cext and v cc . figure 2. truth table and functional description .
mil-m-38510/314c 12 device types 01 and 03 this multivibrator features d-c triggering from gated low level active (a inputs), and high level active (b inputs). output pulse width is a function of external capacitor and resistor values. retriggering of input before output terminates, extends output pulse width. overriding clear feature permits termination of output pulse width at a predetermined time independent of r and c timing components. note: retrigger pulse must not start before 0.22 cext (in picofarads) nanoseconds after previous trigger pulse. figure 2. truth table and functional description - continued.
mil-m-38510/314c 13 device type 01 and 03 (continued) the output pulse width (tp) is a function of the external capacitor and resistor values. for output pulse widths when cext > 1,000 pf, tp is defined as : tp 0.4 r t cext where r t is in k ? , cext is in pf, and tp is in ns. for output pulse widths when cext < 1,000 pf, tp is defined as: note: this value of resistance exceeds the maximum recommended for use over the full temperature range figure 2. truth table and functional description - continued.
mil-m-38510/314c 14 device type 02 this multivibrator features a negative transition triggered input and a positive transition triggered input, either of which can be used as an inhibit input. pulse triggering occurs at a particular voltage level, not directly related to transition time of input pulse. once fired, the outputs are independent of further transitions of a and b inputs, and are a function of the timing components. output pulses can be terminated by the overriding clear, independent of r and c timing components. figure 2. truth table and functional description - continued.
mil-m-38510/314c 15 device type 02 (continued) the output pulse width (tp) is a function of the external capacitor and resistor values. the output pulse width is defined as : tp 0.7 r t cext where r t is in k ? , cext is in pf, and tp is in ns. figure 2. truth table and functional description - continued.
mil-m-38510/314c 16 timing component connections figure 2. truth table and functional description - continued.
mil-m-38510/314c 17 figure 3. switching test circuit and waveforms for device types 01 and 03 .
mil-m-38510/314c 18 notes: 1. pulse generator has the following characteristics: prr 1.0 mhz, t pin 40 ns, t thl 6 ns, t tlh 15 ns, and z out = 50 ?. 2. see table iii notes for rext, cext values. 3. c l = 50 pf 10% including scope probe, wiring and stray capacitance, without package in test fixture. 4. all diodes are 1n3064, or 1n916 or equivalent. 5. load circuit on a given output is only required where the specified test in table iii indicates "out" on that output. 6. t setup (max) shall be 50% of the typical output pulse width for the actual cext used (see figure 2). figure 3. switching test circuit and waveforms for device types 01 and 03 - continued.
mil-m-38510/314c 19 figure 4. switching test circuit and waveforms for device type 02 .
mil-m-38510/314c 20 notes: 1. pulse generator has the following characteristics: prr 1.0 mhz, t pin 40 ns, t thl 6 ns, t tlh 15 ns, t setup1 (clear inactive) = 15 ns and z out = 50 ?. 2. see table iii notes for rext, cext values. 3. c l = 50 pf 10% including scope probe, wiring and stray capacitance, without package in test fixture. 4. all diodes are 1n3064, or 1n916 or equivalent. 5. load circuit on a given output is only required where the specified test in table iii indicates "out" on that output. 6. t setup (max) shall be 50% of the typical output pulse width for the actual cext used (see figure 2). figure 4. switching test circuit and waveforms for device type 02 - continued.
table iii. group a inspection for device type 01 . terminal conditions (pins not designated may be high 2.0 v, low 0.7 v, or open). 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 mil- cases e, f 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 subgroup symbol std-883 method - case 2 measured terminal limits unit test no. a1 b1 clr1 q1 q2 cext2 rext2 gnd a2 b2 clr2 q2 q1 cext1 rext1 v cc min max 1 v oh 3006 1 2.0 v 0.7 v 2.0 v -.4 ma gnd 4.5 v q1 2.5 v tc = 25 c " 2 c 2.0 v 2.0 v " -.4 ma gnd " q1 " " " 3 " 2.0 v 0.7 v 2.0 v -.4 ma " q2 " " " 4 -.4 ma gnd " c 2.0 v 2.0 v " q2 " " v ol 3007 5 2.0 v 0.7 v 2.0 v " 4 ma " q1 0.4 " " 6 c 2.0 v 2.0 v 4 ma " gnd " q1 " " " 7 4 ma " 2.0 v 0.7 v 2.0 v " q2 " " " 8 gnd " c 2.0 v 2.0 v 4 ma " q2 " " v i c 9 -18 ma " " a1 -1.5 " 10 -18 ma " " b1 " " 11 -18 ma " " clr1 " " 12 " -18 ma " a2 " " 13 " -18 ma " b2 " " 14 " -18 ma " clr2 " " i il1 3009 15 0.4 v " 5.5 v a1 -160 -400 a see " 16 0.4 v " " b1 " " " note k " 17 0.4 v " " clr1 " " " " 18 " 0.4 v " a2 " " " " 19 " 0.4 v " b2 " " " " 20 " 0.4 v " clr2 " " " i ih1 3010 21 2.7 v " " a1 20 " " 22 2.7 v " " b1 " " " 23 2.7 v " " clr1 " " " 24 " 2.7 v " a2 " " " 25 " 2.7 v " b2 " " " 26 " 2.7 v " clr2 " " i ih2 " 27 5.5 v " " a1 100 " " 28 5.5 v " " b1 " " " 29 5.5 v " " clr1 " " " 30 " 5.5 v " a2 " " " 31 " 5.5 v " b2 " " " 32 " 5.5 v " clr2 " " i os 3011 33 ckt a, d gnd gnd gnd gnd " " q1 -15 -100 ma " 33 ckt c gnd gnd gnd gnd " " q1 -30 -130 " " 34 ckt c 4.5 v 4.5 v " gnd gnd " q1 -15 -100 " a, d " 34 ckt c 4.5 v 4.5 v " gnd gnd " q1 -30 -130 " c " 35 ckt a, d " gnd gnd gnd gnd " q2 -15 -100 " " 35 ckt c " gnd gnd gnd gnd " q2 -30 -130 " " 36 ckt gnd gnd " c 4.5 v 4.5 v " q2 -15 -100 " a, d " 36 ckt gnd gnd " c 4.5 v 4.5 v " q2 -30 -130 " c see footnotes at end of this table. 21 mil-m-38510/314c
table iii. group a inspection for device type 01 . terminal conditions (pins not designated may be high 2.0 v, low 0.7 v, or open). 1 / 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 mil- cases e, f 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 subgroup symbol std-883 method - case 2 measured terminal limits unit test no. a1 b1 clr1 q1 q2 cext2 rext2 gnd a2 b2 clr2 q2 q1 cext1 rext1 v cc min max 1 i cc2 3005 37 5.5 v 5.5 v 5.5 v gnd 5.5 v 5.5 v 5.5 v 5.5 v v cc 20 ma tc = 25 c 3005 38 c 5.5 v 5.5 v gnd c 5.5 v 5.5 v 5.5 v v cc 20 ma 2 same tests, terminal conditions, and limits as for subgroup 1, except t c = +125 c and v ic tests are omitted. 3 same tests, terminal conditions, and limits as for subgroup 1, except t c = -55 c and v ic tests are omitted. 7 truth 3014 39 a a b h l f f gnd a a b h l f f 5.0 v all see notes tc = 25 c table " 40 a b " " " " " " a b " " " " " " outputs a, b, d, tests " 41 b a " " " " " " b a " " " " " " " e and f " 42 " " a l h " " " " " a l h " " " " " " 43 " " b h l " " " " " b h l " " " " " " 44 " b b " " " " " " b b " " " " " " " " 45 " b a " " " " " " b a " " " " " " " " 46 " a a l h " " " " a a l h " " " " " " 47 " " b h l " " " " " b h l " " " " " " 48 a " b " " " " " a " b " " " " " " " " 49 a " a " " " " " a " a " " " " " " " " 50 b " a l h " " " b " a l h " " " " " " 51 b b b h l " " " b b b h l " " " " " " 52 a b a " " " " " a b a " " " " " " " " 53 " a " " " " " " " a " " " " " " " " " 54 " b " " " " " " " b " " " " " " " " " 55 b b " " " " " " b b " " " " " " " " 8 repeat subgroup 7 at t c = +125 c and t c = -55 c. 9 t plh1 3003 56 in 5.0 v 5.0 v gnd out f f 5.0 v a1 to q1 5 38 ns tc = 25 c fig. 3 57 out f f " in 5.0 v 5.0 v " a2 to q2 " 38 " t plh2 " 58 out f f " gnd in 5.0 v " b2 to q2 " 49 " " 59 gnd in 5.0 v " out f f " b1 to q1 " 49 " t plh3 " 60 gnd in in out " l l " clr1 to q1 " 50 " " 61 l l " gnd in in out " clr2 to q2 " " " t phl1 " 62 f f " in 5.0 v 5.0 v out " a2 to q2 " " " " 63 in 5.0 v 5.0 v out " f f " a1 to q1 " " " t phl2 " 64 gnd in 5.0 v out " f f " b1 to q1 " 61 " " 65 f f " gnd in 5.0 v out " b2 to q2 " 61 " t phl3 " 66 out l l " gnd in in " clr2 to q2 " 32 " " 67 gnd in in " out l l " clr1 to q1 " 32 " t p(min) " 68 in 5.0 v 5.0 v " out open g " q1 205 " " 69 gnd in 5.0 v " out open g " q1 " " " 70 out open g " in 5.0 v 5.0 v " q2 " " " 71 out open g " gnd in 5.0 v " q2 " " see footnotes at end of this table. 22 mil-m-38510/314c
table iii. group a inspection for device type 01 . terminal conditions (pins not designated may be high 2.0 v, low 0.7 v, or open). 1 / 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 mil- cases e, f 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 subgroup symbol std-883 method - case 2 measured terminal limits unit test no. a1 b1 clr1 q1 q2 cext2 rext2 gnd a2 b2 clr2 q2 q1 cext1 rext1 v cc min max 9 t p4 3003 72 out i i gnd gnd in 5.0 v 5.0 v q2 3.5 6.0 s tc = 25 c fig. 3 73 out i i " in 5.0 v 5.0 v " q2 " " " " 74 in 5.0 v 5.0 v " out i i " q1 " " " " 75 gnd in 5.0 v " out i i " q1 " " " 10 same tests and terminal conditions as subgroup 9, except t c = +125 c and limits are as follows: t plh1 is 5 to 57 ns; t plh2 is 5 to 74 ns; t plh3 is 5 to 75 ns; t phl1 is 5 to 75 ns; t phl2 is 5 to 92 ns; t phl3 is 5 to 48 ns; t p(min) is 308 ns; and t p4 is 3.0 to 6.25 s. 11 same tests and terminal conditions as for subgroup 10, except t c = -55 c notes: a. v in = 3.0 v minimum. b. v in = 0.0 v or gnd. c. apply input pulse - - - 2.5 v min/5.5 v max. 0 v d. test numbers 39 through 55 shall be run in sequence. e. output voltages shall be either: h > 1.5 v; l < 1.5 v f. rext = 5 k ? minimum to 180 k ? maximum, connected to v cc ; cext 1,000 f, connected to rext terminal. g. rext = 5 k ? 10%, connected to v cc . i. rext = 10 k ? 10%, connect to v cc ; cext 1,000 f 10%, connected to rext terminal. j. during subgroups 9, 10, 11 testing, rext and cext may remain applied on the side of the device not under test if desired. k. for circuit d, i il1 limits are 120 ma to 360 ma. l. rext = 10 k ? 10%, connect to v cc ; cext 45 pf connected to rext terminal. mil-m-38510/314c 23
table iii. group a inspection for device type 02 . terminal conditions (pins not designated may be high 2.0 v, low 0.7 v, or open). 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 mil- cases e, f 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 subgroup symbol std-883 method - case 2 measured terminal limits unit test no. a1 b1 clr1 q1 q2 cext2 see l rext2 see l gnd a2 b2 clr2 q2 q1 cext1 see l rext1 see l v cc min max 1 v oh 3006 1 2.0 v 0.7 v 2.0 v -.4 ma gnd 4.5 v q1 2.5 v tc = 25 c " 2 c 2.0 v 2.0 v " -.4 ma gnd gnd " q1 " " " 3 " 2.0 v 0.7 v 2.0 v -.4 ma " q2 " " " 4 -.4 ma gnd gnd " c 2.0 v 2.0 v " q2 " " v ol 3007 5 2.0 v 0.7 v 2.0 v " 4 ma " q1 0.4 " " 6 c 2.0 v 2.0 v 4 ma " gnd gnd " q1 " " " 7 4 ma " 2.0 v 0.7 v 2.0 v " q2 " " " 8 gnd gnd " c 2.0 v 2.0 v 4 ma " q2 " " v i c 9 -18 ma " " a1 -1.5 " 10 -18 ma " " b1 " " 11 -18 ma " " clr1 " " 12 " -18 ma " a2 " " 13 " -18 ma " b2 " " 14 " -18 ma " clr2 " " i il2 3009 15 ckt a, c, d 0.4 v 4.5 v 4.5 v " 5.5 v a1 -100 -340 a " 15 ckt b " " " " " a1 -30 -300 " " 15 ckt e " " " " " a1 -160 -400 " " 16 ckt a, c gnd 0.4 v " " " b1 -160 -580 " " 16 ckt b " " " " " b1 -30 -300 " " 16ckt e, d " " " " " b1 -200 -440 " " 17 ckt a,c,d,e " 4.5 v gnd " gnd gnd " clr1 -200 -680 " " 17 ckt b " 4.5 v gnd " gnd gnd " clr1 -30 -300 " " 18 ckt a, c, d " 0.4 v 4.5 v 4.5 v " a2 -100 -340 " " 18 ckt b " " " " " a2 -30 -300 " " 18 ckt e " " " " " a2 -160 -400 " " 19 ckt a, c " gnd 0.4 v " " b2 -160 -580 " " 19 ckt b " " " " " b2 -30 -300 " " 19 ckt e, d " " " " " b2 -200 -440 " " 20 ckt a,c,d,e gnd gnd " " 4.5 v gnd " clr2 -200 -680 " " 20 ckt b gnd gnd " " 4.5 v gnd " clr2 -30 -300 " i ih1 3010 21 2.7 v " " a1 20 " " 22 4.5 v 2.7 v gnd " " b1 " " " 23 4.5 v gnd 2.7 v " " clr1 " " " 24 " 2.7 v " a2 " " " 25 " 4.5 v 2.7 v gnd " b2 " " " 26 " 4.5 v gnd 2.7 v " clr2 " " i ih2 " 27 5.5 v " " a1 100 " " 28 4.5 v 5.5 v gnd " " b1 " " " 29 4.5 v gnd 5.5 v " " clr1 " " " 30 " 5.5 v " a2 " " " 31 " 4.5 v 5.5 v gnd " b2 " " " 32 " 4.5 v gnd 5.5 v " clr2 " " see footnotes at end of this table. 24 mil-m-38510/314c
table iii. group a inspection for device type 02 - continued. terminal conditions (pins not designated may be high 2.0 v, low 0.7 v, or open). 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 mil- cases e, f 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 subgroup symbol std-883 method - case 2 measured terminal limits unit test no. a1 b1 clr1 q1 q2 cext2 see l rext2 see l gnd a2 b2 clr2 q2 q1 cext1 see l rext1 see l v cc min max 1 i os 3011 33 ckt a, b, d, e c 4.5 v 4.5 v gnd gnd gnd gnd 5.5 v q1 -15 -100 ma tc = 25 c " 33 ckt c c 4.5 v 4.5 v " gnd gnd gnd " q1 -30 -130 " " 34 ckt a, b, d, e " gnd gnd gnd gnd " q2 -15 -100 " " 34 ckt c " gnd gnd gnd gnd " q2 -30 -130 " " 35 ckt a, b, d, e gnd gnd gnd " c 4.5 v 4.5 v " q2 -15 -100 " " 35 ckt c gnd gnd gnd " c 4.5 v 4.5 v " q2 -30 -130 " " 36 ckt a, b, d, e gnd gnd gnd gnd " " q1 -15 -100 " " 36 ckt c gnd gnd gnd gnd " " q1 -30 -130 " i cc1 3005 37 5.5 v gnd 5.5 v " 5.5 v gnd 5.5 v " v cc 11 " i cc3 3005 38 c 5.5 v 5.5 v " c 5.5 v 5.5 v " v cc 27 " 2 same tests, terminal conditions, and limits as for subgroup 1, except t c = +125 c and v ic tests are omitted. 3 same tests, terminal conditions, and limits as for subgroup 1, except t c = -55 c and v ic tests are omitted. 7 truth 3014 39 a a b h l f f gnd a a b h l f f 5.0 v all tc = 25 c table " 40 a b " " " " " " a b " " " " " " outputs see notes tests " 41 b a " " " " " " b a " " " " " " " a, b, d, e, and f " 42 " " a l h " " " " " a l h " " " " " 43 " " b h l " " " " " b h l " " " " " 44 " b b " " " " " " b b " " " " " " " 45 " b a " " " " " " b a " " " " " " " 46 " a a l h " " " " a a l h " " " " " 47 " " b h l " " " " " b h l " " " " " 48 a " b " " " " " a " " " " " " " " " 49 a " a " " " " " " " " " " " " " " " 50 b " a l " " " " " " " " h " " " " " 51 " " b h " " " " " " " " l " " " " " 52 " " " " " " " " " " a " " " " " " " 53 " " " " h " " " b " a l " " " " " " 54 " b " " l " " " b b b h " " " " " " 55 a b a " " " " " a b a " " " " " " " 56 " a " " " " " " " a " " " " " " " " 57 " b " " " " " " " b " " " " " " " " 58 b b " " " " " " b b " " " " " " " 8 repeat subgroup 7 at t c = +125 c and t c = -55 c. see footnotes at end of this table. 25 mil-m-38510/314c
table iii. group a inspection for device type 02 - continued. terminal conditions (pins not designated may be high 2.0 v, low 0.7 v, or open). 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 mil- cases e, f 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 subgroup symbol std-883 method - case 2 measured terminal limits unit test no. a1 b1 clr1 q1 q2 cext2 rext2 gnd a2 b2 clr2 q2 q1 cext1 rext1 v cc min max 9 t plh1 3003 59 in 5.0 v 5.0 v gnd out f f 5.0 v a1 to q1 5 75 ns tc = 25 c fig. 4 60 out f f " in 5.0 v 5.0 v " a2 to q2 " 75 " t plh2 " 61 out f f " gnd in 5.0 v " b2 to q2 " 60 " " 62 gnd in 5.0 v " out f f " b1 to q1 " 60 " t plh3 " 63 gnd in in out " n n " clr1 to q1 " 70 " " 64 n n " gnd in in out " clr2 to q2 " 70 " t phl1 " 65 f f " in 5.0 v 5.0 v out " a2 to q2 " 85 " " 66 in 5.0 v 5.0 v out " f f " a1 to q1 " 85 " t phl2 " 67 gnd in 5.0 v out " f f " b1 to q1 " 70 " " 68 f f " gnd in 5.0 v out " b2 to q2 " 70 " t phl3 " 69 out n n " gnd in in " clr2 to q2 " 60 " " 70 gnd in in " out n n " clr1 to q1 " 60 " t p1 " 71 in 5.0 v 5.0 v " out open k " q1 20 75 " " 72 in 5.0 v out " " " " q1 " " " " 73 gnd in out " " " " q1 " " " " 74 gnd in " out " " " q1 " " " " 75 out open k " in 5.0 v 5.0 v " q2 " " " " 76 " " " in 5.0 v " out " q2 " " " " 77 " " " gnd in " out " q2 " " " " 78 out " " " " " " " q2 " " " t p2 " 79 out g g " " " " " q2 70 160 " " 80 " " " " " " out " q2 " " " " 81 " " " in 5.0 v " out " q2 " " " " 82 out " " " in 5.0 v " " q2 " " " " 83 in 5.0 v 5.0 v " out g g " q1 " " " " 84 in 5.0 v " out " " " " q1 " " " " 85 gnd in " out " " " " q1 " " " " 86 " " " " out " " " q1 " " " t p3 " 87 " " " " out i i " q1 600 775 " " 88 " " " out " " " " q1 " " " " 89 in 5.0 v " out " " " " q1 " " " " 90 in 5.0 v " " out " " " q1 " " " " 91 out i i " in 5.0 v 5.0 v " q2 " " " " 92 " " " in 5.0 v " out " q2 " " " " 93 " " " gnd in " out " q2 " " " " 94 out " " " " " " " q2 " " " t p5 " 95 out j j " " " " " q2 5.7 8.0 ms " 96 " " " " " " out " q2 " " " " 97 " " " in 5.0 v " out " q2 " " " see notes at end of this table. 26 mil-m-38510/314c
table iii. group a inspection for device type 02 - continued. terminal conditions (pins not designated may be high 2.0 v, low 0.7 v, or open). 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 mil- cases e, f 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 subgroup symbol std-883 method - case 2 measured terminal limits unit test no. a1 b1 clr1 q1 q2 cext2 rext2 gnd a2 b2 clr2 q2 q1 cext1 rext1 v cc min max 9 t p5 3003 98 out j j gnd in 5.0 v 5.0 v 5.0 v q2 5.7 8.0 ms tc = 25 c fig. 4 99 in 5.0 v 5.0 v " out j j " q1 " " " " 100 in 5.0 v " out " " " " q1 " " " " 101 gnd in " out " " " " q1 " " 102 gnd in " " out " " " q1 " " " 10 same tests and terminal conditions as subgroup 9, except t c = +125 c and limits are as follows: t plh1 is 5 to 113 ns; t plh2 is 5 to 90 ns; t plh3 is 5 to 105 ns; t phl1 is 5 to 128 ns; t phl2 is 5 to 105 ns; t phl3 is 5 to 90 ns; t p1 is 20 to 91 ns; t p2 is 70 to 195 ns; t p3 is 600 to 850 ns; and t p5 is 5.5 to 8.5 ms. 11 same tests and terminal conditions as for subgroup 10, except t c = -55 c notes: a. v in = 3.0 v minimum. b. v in = 0.0 v or gnd. c. apply input pulse - - - 2.5 v min/5.5 v max. 0 v d. test numbers 39 through 58 shall be run in sequence. e. output voltages shall be either: h > 1.5 v; l < 1.5 v f. rext = 1.4 k ? minimum to 70 k ? maximum, connected to v cc ; cext 1,000 f, connected to rext terminal. g. rext = 2 k ? 10%, connected to v cc; cext = 80 pf 10%, connected to rext terminal. i. rext = 10 k ? 10%, connect to v cc ; cext = 100 pf 10%, connected to rext terminal. j. rext = 10 k ? 10%, connect to v cc ; cext = 1.0 f 10%, connected to rext terminal. k. rext = 2 k ? 10%, connect to v cc . l. note f may apply during subgroups 1, 2, and 3 testing if desired. m. during subgroups 9, 10, 11 testing, rext and cext may remain applied on the side of the device not under test if desired. n. rext = 10 k ? 10%, connect to v cc ; cext 45 pf connected to rext terminal. 27 mil-m-38510/314c
table iii. group a inspection for device type 03 . terminal conditions (pins not designated may be high 2.0 v, low 0.7 v, or open). 1 2 3 4 5 6 7 8 9 10 11 12 13 14 mil-std- case a,b,c,d 2 3 4 6 8 9 10 12 13 14 16 18 19 20 subgroup symbol 883 method case 2 measured terminal limits unit test no. a1 a2 b1 b2 clr q gnd q rint nc cext (see i) nc rext cext (see i) v cc min max 1 v oh 3006 1 0.7 v 2.0 v j 2.0 v gnd -.4 ma gnd gnd 4.5 v q 2.5 v tc = 25 c 3006 2 0.7 v " -.4 ma " 4.5 v " q 2.5 " v ol 3007 3 0.7 v " " 4 ma 4.5 v " q 0.4 " 3007 4 0.7 v 2.0 v j " 4 ma " gnd gnd " q 0.4 " v i c 5 -18 ma " " a1 -1.5 " 6 -18 ma " " a2 " " 7 -18 ma " " b1 " " 8 -18 ma " " b2 " " 9 -18 ma " " clr " " i il1 3009 10 0.4 v 4.5 v " 5.5 v a1 -160 -400 a see " 11 4.5 v 0.4 v " " a2 " " " note c " 12 0.4 v 4.5 v " " b1 " " " " 13 4.5 v 0.4 v " " b2 " " " " 14 0.4 v " " clr " " " i ih1 3010 15 2.7 v gnd " " a1 20 " " 16 gnd 2.7 v " " a2 " " " 17 2.7 v gnd " " b1 " " " 18 gnd 2.7 v " " b2 " " " 19 2.7 v " " clr " " i ih2 " 20 5.5 v gnd " " a1 100 " " 21 gnd 5.5 v " " a2 " " " 22 5.5 v gnd " " b1 " " " 23 gnd 5.5 v " " b2 " " " 24 5.5 v " " clr " " i os 3011 25 ckt a,d gnd 4.5 v j 4.5 v " gnd gnd gnd " q -15 -100 ma " 25 ckt c gnd 4.5 v j " " gnd gnd gnd " q -30 -130 " " 26 ckt a,d gnd " gnd " 4.5 v " q -15 -100 " " 26 ckt c gnd " gnd " 4.5 v " q -30 -130 " i cc1 3005 27 5.5 v 5.5 v gnd gnd 5.5 v " 5.5 v " v cc 11 " i cc2 3005 28 j j 5.5 v 5.5 v 5.5 v " 5.5 v " v cc 11 " 2 same tests, terminal conditions, and limits as subgroup 1, except t c = 125 c and v i c tests are omitted. 3 same tests, terminal conditions, and limits as subgroup 1, except t c = -55 c and v i c tests are omitted. 7 truth 3014 29 b b b b b h gnd l k k 5.0 v all tc = 25 c table " 29a a a b b b " " " " " " outputs see notes a, b test " 30 a a a a a " " " " " " " " 31 b b " " a l " h " " " " " 321 " " " " b h " l " " " " " 33 " " " " a l " h " " " " " 34 " a b " b h " l " " " " " 35 " " b " a h " l " " " " see footnotes at end of this table. 28 mil-m-38510/314c
table iii. group a inspection for device type 03 ? continued. terminal conditions (pins not designated may be high 2.0 v, low 0.7 v, or open). 1 2 3 4 5 6 7 8 9 10 11 12 13 14 mil-std- case a,b,c,d 2 3 4 6 8 9 10 12 13 14 16 18 19 20 subgroup symbol 883 method case 2 measured terminal limits unit test no. a1 a2 b1 b2 clr q gnd q rint nc cext (see i) nc rext cext (see i) v cc min max 7 truth 3014 36 b a a a a l gnd h k k 5.0 v all tc = 25 c table " 37 " " " b b h " l " " " outputs see notes a, b test " 38 " " " b a h " l " " " " " 39 " " " a a l " h " " " " " 40 a " " " b h " l " " " " " 41 a " " " a h " l " " " " " 42 b " " " a l " h " " " " " 43 a " " " b h " l " " " " " 44 " " " " a h " l " " " " " 45 " b " " a l " h " " " " 8 repeat subgroup 7 at t c = +125 c and t c = -55 c. 1 t phl1 3003 46 in 5.0 v 5.0 v 5.0 v 5.0 v out gnd k k 5.0 v a1 to q 5 50 ns tc = 25 c t phl2 (fig. 3) 47 gnd gnd in 5.0 v 5.0 v out " k k " b1 to q 61 " t phl3 " 48 gnd gnd 5.0 v in in " out m m " clr to q 32 " t plh1 " 49 in 5.0 v 5.0 v 5.0 v 5.0 v " out k k " a1 to q 38 " t plh2 " 50 gnd gnd in 5.0 v 5.0 v " out k k " b1 to q 49 " t plh3 " 51 gnd gnd 5.0 v in in out " m m " clr to q 50 " t p(min) " 52 in 5.0 v 5.0 v 5.0 v 5.0 v " out g " q 205 " t p4 " 53 gnd gnd in 5.0 v " out f n " q 3.5 6.0 s 10 same tests and terminal conditions as subgroup 9 except t c = +125 c and limits are as follows: t phl1 is 50 to 75 ns; t phl2 is 5 to 92 ns; t phl3 is 5 to 48 ns; t plh1 is 5 to 57 ns; t plh2 is 5 to 74 ns; t plh3 is 5 to 75 ns; t p(min) is 308 ns; and t p4 is 3.0 to 6.25 s. 11 same tests and terminal conditions as subgroup 10 except t c = -55 c. notes: a. v in = 3.0 v minimum. b. v in = 0.0 v or gnd. c. for circuit d, iil1 limits are 120 to 360 ma. d. test numbers 29 through 45 shall be run in sequence. e. output voltages shall be either: h > 1.5 v; l < 1.5 v f. cext connected to rext/cext through a 1,000 pf 10% capacitor. g. rext/cext connected to v cc through a 5 k ? 10% resistor. i. note k may apply during subgroups 1, 2, and 3 testing if desired. j. apply input pulse - - - 2.5 v min/5.5 v max. 0 v k. rext/cext connected to v cc through a 5 k ? to 180 k ? resistor, and cext connected to rext/cext through a 1,000 f capacitor. m. cext connected to rext/cext through a 45 pf capacitor, rext/cext connected to v cc through a 10 k ? 10% resistor. n. rext/cext connected to v cc through a 10 k ? 10% resistor. mil-m-38510/314c 29
mil-m-38510/314c 30 5. packaging 5.1 packaging requirements. for acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). when actual packaging of materiel is to be performed by dod personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. packaging requirements are maintained by the inventory control point's packaging activity within the military department of defense agency, or within the military department's system command. packaging data retrieval is available from the managing military department's or defense agency's automated packaging files, cd-rom products, or by contacting the responsible packaging activity. 6. notes (this section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 intended use. microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment. 6.2 acquisition requirements. acquisition documents should specify the following: a. title, number, and date of the specification. b. complete part number (see 1.2). c. requirements for delivery of one copy of the quality conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable. d. requirements for certificate of compliance, if applicable. e. requirements for notification of change of product or process to contracting activity in addition to notification to the qualifying activity, if applicable. f. requirements for failure analysis (including required test condition of method 5003 of mil-std-883), corrective action, and reporting of results, if applicable. g. requirements for product assurance options. h. requirements for special carriers, lead lengths, or lead forming, if applicable. these requirements should not affect the part number. unless otherwise spec ified, these requirements will not apply to direct purchase by or direct shipment to the government. j. requirements for "jan" marking. 6.3 superseding information . the requirements of mil-m-38510 have been superseded to take advantage of the available qualified manufacturer listing (qml) system provided by mil-prf-38535. previous references to mil-m- 38510 in this document have been replaced by appropriate references to mil-prf-38535. all technical requirements now consist of this specification and mil-prf-38535. the mil-m-38510 specification sheet number and pin have been retained to avoid adversely impacting existing governm ent logistics systems and contractor's parts lists. 6.4 qualification . with respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for incl usion in qualified manufacturers list qml-38535 whether or not such products have actually been so listed by that date. the attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the federal government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. information pertaining to qualification of products may be obtained from dscc-vq, 3990 e. broad street, columbus, ohio 43123-1199 .
mil-m-38510/314c 31 6.5 abbreviations, symbols, and definitions. the abbreviations, symbols, and definitions used herein are defined in mil-prf-38535, mil-hdbk-1331, and as follows: gnd ........................................... ground zero voltage potential i in ................................................ current flowing into an input terminal v ic ............................................... input cl amp voltage v in ............................................... voltage level at an input terminal 6.6 logistic support. lead materials and finishes (see 3.4) are interchangeable. unless otherwise specified, microcircuits acquired for government logistic support will be acquired to device class b (see 1.2.2), lead material and finish a (see 3.4). longer length leads and lead forming should not affect the part number. 6.7 substitutability. the cross-reference information below is presented for the convenience of users. microcircuits covered by this specification will functionally replace the listed generic-industry type. generic-industry microcircuit types may not have equivalent operational per formance characteristics across military temperature ranges or reliability factors equivalent to mil-m-38510 device types and may have slight physical variations in relation to case size. the presence of this information should not be deemed as permitting substitution of generic-industry types for mil-m-38510 types or as a waiver of any of the provisions of mil-prf-38535. military device type generic-industry type 01 54ls123, 74ls123 02 54ls221, 74ls221 03 54ls122, 74ls122 6.8 manufacturers' designation. manufacturers' circuits, which form a part of this specification, are designated as shown in table iv herein. table iv. manufacturers' designation. manufacturers a b c d e device type texas instru- ments inc. signetics corporation national semiconductor corp motorola inc raytheon company 01 x x x 02 x x x x 03 x x x x 6.9 changes from previous issue. asterisks are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. custodians: preparing activity: army - cr dla - cc navy - ec air force - 11 (project 5962-1964) dla - cc review activities: army - mi, sm navy - as, cg, mc, sh, td air force - 03, 19, 99
standardization document improvement proposal instructions 1. the preparing activity must complete blocks 1, 2, 3, and 8. in block 1, both the document number and revision letter shoul d be given. 2. the submitter of this form must complete blocks 4, 5, 6, and 7, and send to preparing activity. 3. the preparing activity must provide a reply within 30 days from receipt of the form. note: this form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on c urrent contracts. comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend contractual requirements. i recommend a change: 1. document number mil-m-38510/314c 2. document date (yyyymmdd) 2003-07-14 3. document title microcircuits, digital, low-power schottky ttl, monostable multivibrators, monolithic silicon 4. nature of change (identify paragraph number and include proposed rewrite, if possible. attach extra sheets as needed.) 5. reason for recommendation 6. submitter a. name (last, first middle initial) b. organization c. address (include zip code) d. telephone (include area code) (1) commercial (2) dsn (if applicable) 7 . date submitted (yyyymmdd) 8. preparing activity a. name defense supply center, columbus b. telephone (include area code (1) commercial 614-692-0536 (2) dsn 850-0536 c. address (include zip code) dscc-va p. o. box 3990 columbus, ohio 43216-5000 if you do not receive a reply within 45 days, contact: defense standardization program office (dlsc-lm) 8725 john j. kingman road, suite 2533 fort belvoir, virginia 22060-6221 telephone (703)767-6888 dsn 427-6888 dd form 1426, feb 1999 (eg) previous editions are obsolete. whs/dior, feb 99

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